Recent #performance improvement news in the semiconductor industry

3 months ago
1. Intel's 18A process node is ready for customer projects, offering 15% better performance per watt and 30% better chip density than Intel 3. 2. Intel's Xeon 6 processors have been adopted by major partners like Dell, AT&T, and Cisco, reinforcing its position in the AI and data center market. 3. Despite recent revenue declines, Intel aims for 6% future growth driven by client computing, data center, AI, and foundry segments.
Market Positionperformance improvementrevenue growth
6 months ago
➀ TSMC unveiled details about its N2 (2nm-class) fabrication process at IEDM 2024; ➁ The new process promises a 24 to 35% power reduction or a 15% performance improvement at the same voltage; ➂ Key advancements include GAA nanosheet transistors and N2 NanoFlex design-technology co-optimization.
2nm processMicroelectronicsSRAMTSMCperformance improvementsemiconductor
8 months ago
➀ The adoption of chiplets in domain-specific applications is creating complex partitioning challenges; ➁ Major companies are focusing on chiplets to improve performance and reduce power; ➂ Partitioning involves mapping optimal data paths, load balancing, and signal path workarounds; ➃ The shift towards chiplets is driven by scaling benefits limitations; ➄ Chiplets are assembled into advanced packages, affecting partitioning complexity; ➅ Partitioning determines application mapping, processing, and data movement priorities; ➆ Signal integrity challenges and power integrity issues arise with chiplet design; ➇ Chiplet partitioning must consider signal integrity, power integrity, and thermal gradients; ➈ Multi-vendor ecosystems and standard chiplet sockets are crucial for successful partitioning.
Advanced Packagingchipletsperformance improvement